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JTX Swap Board CPU Chip Reballing Platform for iPhone 8-16 Pro Max Option:SM-02 It can support simultaneous output

4.6
USD33.99 USD71.99

Pay in 4 interest-free payments of $8.50 Learn more

SKU: 55893607705

Shipping Estimate
USA
  • USA
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Ships within 48 hours · Estimated delivery Sep 7 - Sep 12

Description

It can support simultaneous output of two or three devices

Power: 120W/160W(Max)

Qualcomm QC3

bilateral rotatable adjustment

JTX Swap Board CPU Chip Reballing Platform for iPhone 8-16 Pro Max Option:SM-02 It can support simultaneous outputJTX SM 01 Swap Master 30 in 1 Tinning Platform with BGA stencil for iPhone 8 16 Pro Max motherboard replacement and CPU BGA chip reballing. Super Magnetic Positioning Tinning Platform for iPhone PCB board swapping chips rapid positioning, allows for reballing of multiple chip sizes at once, and the strong magnetism aids the reballing process, ensuring optimal solder component placement. Option: 1. SM 01: For iPhone 8 8P X Qualcomm. 2. SM 02: For

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