Washi room edit · Quiet free shipping over $75 · Soft restocks

SIM8200-M2 SIMCom Original 5G Module rpi heat sink Works in –20°C to 60°C

4.5
USD13825.00 USD13866.00

Pay in 4 interest-free payments of $3456.25 Learn more

SKU: 53039376151

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 7 - Sep 12

Description

Works in –20°C to 60°C

3 Wire and 4 Wire SPI Communication

Technical Datasheet can be found here

Metal alloy mechanical arm with 6 Degree of Freedom

SIM8200-M2 SIMCom Original 5G Module rpi heat sink Works in –20°C to 60°CIM8200 M2 SIMCom Original 5G Module M. 2 Form Factor, High Throughput Data Communication The SIM8200 M2 series is the Multi Band 5G NR LTE FDD LTE TDD HSPA+ module which supports R15 5G NSA SA up to 2. 4Gbps data transfer. It has strong extension capability with rich interfaces including UART,PCIe,USB3. 1, GPIO etc. The module provides much flexibility and ease of integration for customer's application. The SIM8200 M2 series adopts M. 2 form factor,

You may also like

recommand products